puce_DIL16 modèle 3D

Low poly integrated circuit model, chip in DIL16 package. Built with Maya 7, clean topology, no N-gons. UV mapped, unwrapping done with no overlapping, rendered with V-ray (ver. 1.5) renderer in 3ds Max, render scene included. Basic blinn materials with Layered Textures node in Maya file. Maya 7 (.ma, .mb), OBJ (.obj with .mtl), 3ds Max 2009 (.max) and Autodesk FBX (.fbx) format included. FBX and OBJ are directly exported from Maya. Polygons: 857 quads/ 1692 triangles Vertices: 878 Textures included in chip_DIL16_textures.zip file: -1024×1024 pixels .jpg opacity (transparent) map for label, 2 versions -1024×1024 pixels .jpg diffuse (color) map, 2 versions - not used -1024×1024 pixels .psd working map - if you need to change label or make another texture (see thumbs)