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Modelos 3D Advanced Vacuum Vision 320 RIE

Advanced Vacuum Vision 320 RIE Modelo 3D

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Advanced Vacuum Vision 320 RIE royalty-free 3d model - Preview no. 1
Advanced Vacuum Vision 320 RIE royalty-free 3d model - Preview no. 2
Advanced Vacuum Vision 320 RIE royalty-free 3d model - Preview no. 3
Advanced Vacuum Vision 320 RIE royalty-free 3d model - Preview no. 4
Advanced Vacuum Vision 320 RIE royalty-free 3d model - Preview no. 5
Advanced Vacuum Vision 320 RIE royalty-free 3d model - Preview no. 6
Advanced Vacuum Vision 320 RIE royalty-free 3d model - Preview no. 1
Advanced Vacuum Vision 320 RIE royalty-free 3d model - Preview no. 2
Advanced Vacuum Vision 320 RIE royalty-free 3d model - Preview no. 3
Advanced Vacuum Vision 320 RIE royalty-free 3d model - Preview no. 4
Advanced Vacuum Vision 320 RIE royalty-free 3d model - Preview no. 5
Advanced Vacuum Vision 320 RIE royalty-free 3d model - Preview no. 6
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Enviado por twotiredtigers

Especificações

  • Geometriapolygonal
  • Polígonos25,732
  • Vértices36,825
  • TexturasYes
  • RiggedNo
  • AnimadoNo
  • Pronto para impressão em 3DNo
  • Jogo pronto (baixo poli)No
  • Mapeado por UVYes
  • UVs não enroladosnone

Formatos e Arquivos

FBX
(.fbx)
13 MB

Advanced Vacuum Vision 320 RIE.FBX
OBJ
(.obj)
3 MB

OBJ.obj
3ds Max
(.max)
6 MB

vray
Advanced Vacuum Vision 320 RIE_14.max
3ds Max
(.max)
6 MB

vray
Advanced Vacuum Vision 320 RIE_11.max
3ds Max

Screen_01.jpg
3ds Max

PVD-75 Label.jpg
3ds Max

PVD-75 Label Mask.jpg
3ds Max

Logo_2_Op.jpg
3ds Max

Logo_2.jpg
3ds Max

Advanced Vacuum Label_Op.jpg
3ds Max

Advanced Vacuum Label.jpg
3ds Max

6svd4c8o.jpg

Tag

AdvancedVacuumVision320RIE3dmaxvácuo avançadofabricaçãoHitechindústriaplantarprototipagemsemicondutorSuperfícietecnologiaferramentavray

Descrição

Model of Advanced Vacuum Vision 320 RIE. Description from producer: Advanced Vacuums Vision 320 RIE provides etch capability for R&D, prototyping, and low volume production. This parallel-plate capacitance based systems is found in applications that include fundamental material studies, surface modification, semiconductor device fabrication, and failure analysis involving delayering. Modeled with Inventor and 3ds Max 2014. Dimensions: 845x1400x2140 mm Images are raw renders.
Feb 28, 2018 data adicionada
Aug 09, 2021 última atualização

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