USB Prizi Yığını Çevre Birimi 3D model

Highly detailed to scale modelled USB Type A receptacle stack (USB 1.0, 1.1, 2.0) for placing onto the PCB of an (transparent/translucent/open) USB device. Consisting of 5 layers: 1 Pins <- 2 Plastic <- 3 Cover <-5 Cover_Rear ^- 4 Tin-solder (removed in most presentation Images) Includes 7 morphs to remove the tin-solder and move groups of pins (contact, centering, locking) Surfaces set up for Radiosity. (No Specularity or Glossiness requierd). Scenes for all presentation Images are included. (bakeing radiosity scene may be requierd, as the cache files are not included) No textures required but uses some of LightWave's build in nodes and procedurals. preview_items_texture.jpg is only used for the scene light. Made and rendered with LightWave 3D 10.1 out of the box using polygonal modelling. (Geometry) Will work with LightWave 3D 6.0 and up or any other program that supports LWO2.