芯片包装 3D模型
0
规格
- 几何polygonal_quads only
- 多边形4,912
- 顶点4,914
- 纹理Yes
- 索具化No
- 动画No
- 适合3D打印No
- 适合游戏(低多边形)No
- UV映射Yes
- 未封装UVnon-overlapping
描述
High-quality, photo-realistic model of a chips packaging.
Great for close-up or any other project.
Made in Blender v2.79.
Rendered with Cycles.
Scene is included.
Subdivision Level 0:
Polygons: 4912
Vertices: 4914
Subdivision Level 1:
Polygons: 19648
Vertices: 19650
- Clean geometry
- Proper names
- Real World Scale
- Units: Centimeters
Width: 23,4 cm
Height: 34,5 cm
- Model placed at: (0,0,0)
- This model contains 1 object
- Textures (2):
Format: .png
Resolution :4096x4096
Enjoy!
Leave a rate if you like it - your opinion is important for me.
Jan 11, 2018
添加日期
Jan 21, 2022
最后更新
评测
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