BGA-204 FLIP CHIP 3D 모델
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875
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VISUAL3DFX
명세서
- 기하학polygonal
- 다각형0
- 정점들0
- 텍스처No
- 딱딱한No
- 생기 있는No
- 3D 인쇄 가능 준비No
- 게임 준비 (낮은 폴리)No
- UV 매핑 됨No
- 포장되지 않은 자외선unknown
기술
MODEL
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A detail model of BGA-240 Flip Chip. This type of flip chip is a reverse chipset inside with ball-socket solder joints. The model is highly detailed and accurate to dimension.
MATERIALS & TEXTURES
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Unless stated all materials are a mixture of 3DSMAX Standard and VRAY.
LIGHTING AND RENDERING
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NOTE: THIS MODEL IS VRAY READY.
Apart from being VRAY ready this model is also compatible with other 3rd Party Rendering systems and 3DSMAX Scanline.
Mar 13, 2018
추가 된 날짜
Feb 07, 2022
마지막 업데이트
리뷰
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