BGA-204 FLIP CHIP 3D Model
0
Specifications
- Geometrypolygonal
- Polygons0
- Vertices0
- TexturesNo
- RiggedNo
- AnimatedNo
- 3D Printable ReadyNo
- Game Ready (low poly)No
- UV MappedNo
- Unwrapped UVsunknown
Description
MODEL
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A detail model of BGA-240 Flip Chip. This type of flip chip is a reverse chipset inside with ball-socket solder joints. The model is highly detailed and accurate to dimension.
MATERIALS & TEXTURES
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Unless stated all materials are a mixture of 3DSMAX Standard and VRAY.
LIGHTING AND RENDERING
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NOTE: THIS MODEL IS VRAY READY.
Apart from being VRAY ready this model is also compatible with other 3rd Party Rendering systems and 3DSMAX Scanline.
Mar 13, 2018
date added
Feb 07, 2022
last update
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