옥수수 칩 3D 모델

Realistic 3D model of the Corn Chip * The materials are available in the 3ds Max file format with V-Ray and Scanline Render -Scene lighting is included, ready for instant rendering * The entire model is subdivided -3ds Max files: TurboSmooth modifier can be used to increase mesh resolution if necessary -Two FBX files: subdivision level 0 subdivision level 1 (render scene) -Two OBJ files: subdivision level 0 subdivision level 1 -Two 3DS files: subdivision level 0 subdivision level 1 * All the objects of the model are named * All the materials are named * Clean UVs (Non-overlapping) * Texture: -Model Map JPEG (.jpg)-2048*2048 (diffuse, specular, bump and normal map) -Environment Map (Reflection) V-Ray Renderer: HDRI- 750*750 Default Scanline Renderer: JPEG (.jpg)- 512*512 * Requires 3ds Max Version 2010 and higher * Real-world scale (Millimeters)