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3D模型 铺设包装和芯片

铺设包装和芯片 3D模型

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铺设包装和芯片 royalty-free 3d model - Preview no. 1
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3,078 访问量
提交者 iskren87

规格

  • 几何polygonal_quads/tris
  • 多边形159,000
  • 顶点100,000
  • 纹理Yes
  • 索具化No
  • 动画No
  • 适合3D打印No
  • 适合游戏（低多边形）No
  • UV映射No
  • 未封装UVunknown

格式和文件

3DS
(.3ds)
4 MB

Lays.3DS
DXF
(.dxf)
64 MB

Lays.DXF
FBX
(.fbx)
2 MB

Lays.FBX
OBJ
(.obj)
13 MB

Lays.obj
3ds Max
(.max)
8 MB

vray 3.0
Lays1.max
3ds Max
(.max)
8 MB

vray 3.0
Lays2011.max
3ds Max
1 MB

Textures.rar

标签

3d包烘烤的切碎的吃食物炒垃圾铺设盒照片真实感土豆实际的闪亮的蔬菜

描述

All models and textures are made by me. This scene contains: 2 x bags of chips Lays with glossy surface 2 x bags of chips Lays with matte surface few potato chips, with texture and bump maps white plane and lights. Please check my other models bellow ! Thank you.
Jan 11, 2018 添加日期
Sep 30, 2022 最后更新

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