芯片包装 3D模型

DESCRIPTION A High Quality Photo Real model for a chips package will enhance detail and realism to any of your rendering projects. The model has a fully textured, detailed design that allows for close-up renders, and was originally modeled in 3ds Max 2013 and rendered with V-Ray. Hope you like it! --------------------------------------------------------------------------- Features: -Psd file is available to change the, logo ,colors, etec... -No errors or missing files -no Overlapping vertex nor faces -no N-GONS Faces -The light Rig is included just press render to get the same result - Model is fully textured with all materials applied. - No part-name confusion when importing several models into a scene. - No cleaning up necessary just drop your models into the scene and start rendering. - Real Time Scale (Units: cm) -Objects are logically named for ease of scene management. -3ds Max models are grouped for easy selection --------------------------------------------------------------------------- Textures( PNG formats) the model comes with a pbr textures (Diffuse-Glossiness-specular-normal) with resolution 2048x2048 Chips_Diffuse.Png Chips_Specular.png Chips_Glossiness.png Chips_Normal.Png ------------------------------------------------------------------------------- Formats 1-3ds Max 2013 Vray 2-FBX 3-OBJ 4-Others : PSD file 5-3ds ----------------------------------------------------------------------------- Hope you like it! Also check out my other models, just click on my user name to see complete gallery.